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Cooling air flow systems for a high-heat-density equipment room. 1. Comparison of flow systems and examination of equipment inlet air temperature model.

[In Japanese. / En japonais.]

Author(s) : NAKAO M., HAYAMA H., NISHIOKA M., MATSUO Y.

Type of article: Article

Summary

Highly efficient cooling systems for telecommunication and information processing equipment are becoming increasingly necessary as the equipment may be packaged in high density. The following air flow distribution systems are compared for cooling efficiency in a high-heat-density room on a real scale (19.2 x 7.4 x 2.4 m, from 300 to 1000 watts/m2): underfloor air supply and overhead return, underfloor air supply and horizontal return, overhead air supply and underfloor return, overhead air supply and horizontal return. The underfloor supply and overhead return system was found to be best. A ventilation ratio model for the system is proposed to describe non-dimensional average inlet air temperature to the equipment, named average ratio of temperature difference, and standard ratio of temperature deviation; these are described by the ratio of supply flow rate to equipment intake flow rate and the ratio of equipment returned flow rate to equipment exhaust flow rate.

Details

  • Original title: [In Japanese. / En japonais.]
  • Record ID : 1994-3789
  • Languages: Japanese
  • Source: Transaction of the Society of Heating, Air-conditioning and Sanitary Engineers of Japan - n. 54
  • Publication date: 1994/02
  • Document available for consultation in the library of the IIR headquarters only.

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