Liquid-cooled PCs: the next hot thing?
Author(s) : BARAN N.
Type of article: Article
Summary
The latest computer chips pack an enormous power into a very small space. They need cooling. A cooling system has been devised which requires no operating energy except the heat it is removing. The chip is mounted in contact with an evaporator in which a refrigerant, fluorinert, vaporises at about 60 deg C. The rising vapour pressure opens a valve and admits the vapour to an air cooled condenser from where the condensate is returned to the evaporator. The condenser can be as small as 160 x 80 mm, sufficiently compact to fit behind a laptop computer's display panel. The weight of the system is only 75 g. D.W.H.
Details
- Original title: Liquid-cooled PCs: the next hot thing?
- Record ID : 1995-0555
- Languages: English
- Source: Byte - vol. 19 - n. 2
- Publication date: 1994/02
- Document available for consultation in the library of the IIR headquarters only.
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Indexing
- Themes: Civil engineering
- Keywords: Computer; Thermosyphon; Cooling; Microprocessor; Information technology; Refrigerant; Component
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- Date : 1993
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