ShareMECHANICAL PROPERTIES OF INDIUM BASED EUTECTIC ALLOY SOLDERS USED IN JOSEPHSON PACKAGING.
Author(s) : YEH J. T. C.
Type of article: Article
Summary
INDIUM-BISMUTH-TIN AND INDIUM-TIN EUTECTIC ALLOY SOLDERS ARE USED IN THE PACKAGING OF THE CRYOGENIC JOSEPHSON PROCESSOR. TENSILE AND SHEAR STRENGTHS OF BULK SOLDERS WERE MEASURED AT AND BELOW ROOM TEMPERATURE. IT IS FOUND THAT THE ULTIMATE TENSILE AND SHEAR STRENGTHS OF BULK SOLDERS INCREASE AS TEMPERATURE DECREASES. AT LOW TEMPERATURES, THE ULTIMATE TENSILE STRENGTH OF INDIUM-BISMUTH-TIN ALLOY IS ABOUT THREE TIMES LESS THAN THAT OF INDIUM-TIN ALLOY.
Details
- Original title: MECHANICAL PROPERTIES OF INDIUM BASED EUTECTIC ALLOY SOLDERS USED IN JOSEPHSON PACKAGING.
- Record ID : 1985-0458
- Languages: English
- Source: Cryogenics - vol. 24 - n. 5
- Publication date: 1984
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Indexing
- Themes: Superconduction
- Keywords: Welding; Mechanical property; Bismuth; Alloy; Indium; Tin; Josephson junction
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