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Thermal control of power electronic equipment by liquid cooled cold-plates.

Author(s) : CESINI G., RICCI R., RIPANI R.

Summary

The purpose of this work is the study of the thermal behaviour of liquid cooled pin fin surfaces for cold-plate applications. The main area of the research is the thermal control of power electronic devices and components where very high specific heat fluxes are generated. In order to evaluate convective heat transfer coefficients on the pins, an experimental procedure based on thermographic investigations of the fins is presented and preliminary results obtained for a simple cylindrical pin at low aspect-ratio are reported.

Details

  • Original title: Thermal control of power electronic equipment by liquid cooled cold-plates.
  • Record ID : 2000-0037
  • Languages: English
  • Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
  • Publication date: 1997/10/24
  • Document available for consultation in the library of the IIR headquarters only.

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