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Thermomechanical issues in electronic packaging and assembly.

Author(s) : BEYNE E., VANDEVELDE P., CHRISTIAENS F.

Summary

The paper presents the thermomechanical problems occurring in electronic packages and assemblies. The influence of temperature on electrical, mechanical, and corrosion failures is reviewed. It will be shown that most of the mechanical failures result from temperature fluctuations in time. Thermal fatigue is therefore seen as the most critical mechanical failure mechanism. In this paper, the principles of fatigue theory are reviewed. Some numerical methods to estimate the thermal fatigue resistance of packages are shown.

Details

  • Original title: Thermomechanical issues in electronic packaging and assembly.
  • Record ID : 2000-0433
  • Languages: English
  • Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
  • Publication date: 1997/10/24
  • Document available for consultation in the library of the IIR headquarters only.

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